How it works
The Newmarket laboratory offers contracted microelectronics assembly, prototype validation and failure analysis. An ISO Class 6 cleanroom supports die attach, flip-chip/underfill, wire bonding and small-component SMT, alongside environmental/mechanical testing and materials analysis. Celestica’s 2021 Kepler case study reports vibration testing during 2020, with a named customer quotation; it does not publish a satellite qualification report or universal flight acceptance.
Technical detail
Core features
- ISO Class 6 cleanroom, die attach, flip-chip underfill, gold/aluminium wire bonding and SMT from 01005 components to BGAs greater than 75 mm.
- Temperature/humidity cycling, vibration/shock and accelerated stress testing; actual test limits and profiles depend on the selected equipment and specimen.